- Location
- Malacca, Malacca,MY, MY
- Type
- Full-time
- Department
- Management
- Seniority
- Manager
- Experience
- 2+ years
- Education
- Master
- Source
- Eightfold
Description
Oversee end-to-end execution of new package development, ensuring alignment with project timelines, budgets, and defined technical and quality benchmarks. Coordinate cross-functional collaboration among packaging team members, business unit partners, and relevant interfaces to ensure seamless project execution. Deliver products that meet committed specifications in functionality, reliability, delivery schedule, volume, and cost. Ensure robust deployment of control plans and quality assurance measures throughout the development cycle. Define and monitor key process parameters, ensuring effective controls are in place to maintain product integrity and compliance. Minimum of 5 years of relevant working experience, including at least 2 years in leading projects. Proven experience in semiconductor R&D, specifically within the packaging group. Strong project management expertise covering project initiation, planning, execution, closing, as well as reporting and documentation. Analytical mindset with high initiative, capable of challenging self and team to achieve higher levels of competency. Familiarity with analytical tools such as surface analysis, material characterization, Design of Experiments (DoE), Design/Process FMEA (D/PFMEA), 8D methodology, and simulation techniques will be an added advantage. Knowledge of intellectual property (IP) management, including patent filing processes. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.