Hiring.Camp

Senior Engineer, Unit Process Modeling

Micron Technology

·

Jul 29, 2026

Location
Hyderabad, TS,IN, IN
Type
Full-time
Department
Engineering
Seniority
Senior
Education
PhD
Source
Eightfold

Description

Req. ID:

JR106806 Senior Engineer, Unit Process Modeling

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

In the Technology Development — Advanced Modeling & AI Solutions (AMAIS) organization, you will be part of a multidisciplinary team developing next-generation Digital Twins, predictive modeling solutions, and AI-driven technologies that accelerate advanced memory development and manufacturing excellence. You will create predictive digital representations of semiconductor processes, materials, structures, equipment, and products across DRAM, NAND, and advanced packaging technologies including HBM. Leveraging physics-based modeling, computational methods, machine learning, GenAI, large language models (LLMs), and agentic AI frameworks, you will enable technology co-optimization, design-space exploration, process optimization, yield improvement, and accelerated technology learning. Working at the intersection of engineering fundamentals, manufacturing data, and digital engineering, you will develop scalable predictive and prescriptive solutions that connect process, structure, performance, yield, reliability, and cost. This role offers the opportunity to influence critical technology decisions, drive fab-technology co-optimization, and advance Micron's leadership in data-driven semiconductor memory innovation.

Qualifications:

  • Independence – be comfortable executing activities and needs
  • Experience in algorithm development, numerical methods, and scientific computing
  • Solid experience with Plasma, FPM, HAR etching, and MC modeling
  • Experience with Wet Processes, Chemical Etching and Strip, Material selectivity, Chemistry evaluation, etc.
  • Strong background in thermodynamics, physics, and chemistry
  • Experience with computational materials science methodologies
  • Familiar with machine learning and deep learning concepts and applications
  • Experience with regression, neural networks, and frameworks
  • Familiar with process and multi-physics modeling, and implementation
  • Experience with common modeling software, previous software development and Linux experience
  • Experience with Bash, Python, FORTRAN, or C++
  • Experience with OpenFOAM, ANSYS Fluent, COMSOL, HPEM
  • Strong debug and problem-solving skills
  • Experience writing reports and conference papers
  • Excellent written and verbal communication
  • Ability to work in a team environment and experience with remote collaboration tools

Responsibilities

  • Develop and deploy Digital Twins and predictive models spanning process, wafer, die, package, and manufacturing domains to enable technology and fab co-optimization.
  • Develop structural and Multiphysics models to evaluate process-structure-performance interactions, including stress, deformation, cracking, voiding, and reliability risks.
  • Build physics-informed composite AI models that accelerate technology development, yield improvement, reliability assessment, and design-space exploration.
  • Apply advanced computational methods, machine learning, and sparse-data modeling techniques to create robust predictive and prescriptive solutions for complex semiconductor challenges.
  • Utilize state-of-the-art GenAI, LLM-powered copilots, RAG systems, and agentic AI workflows that integrate engineering tools, knowledge bases, simulation environments, and manufacturing data.
  • Collaborate across global engineering teams to translate modeling insights into actionable technology decisions.

Experience: 5+ years of modeling

Education: Ph.D. in Applied Chemistry, Applied Physics, Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related fields.

Job Profile(s):

Semiconductor Design Engineer 3

Relocation level: (TBD)

Before Getting Started

Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:

  • Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
  • If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

​​​​

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Skills

PythonLinuxMachine LearningDeep Learning

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